- Primary category
- Electronics & Electronic Materials
- Product Family
- Electronic Epoxy Curing Materials
Product overview
Dicyandiamide (DICY) is a functional material evaluated for One-component latent epoxy curing, Powder coatings, Structural and electronic adhesives. Suitability for electrical or electronic use depends on the exact grade, impurity profile, particle-size or cure data, application testing and destination-market requirements.
Function & Usage
- Cure & Accelerate Electronic Epoxy Systems
Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: One-component latent epoxy curing, Powder coatings, Structural and electronic adhesives.
- Build Laminates & Protect Copper
Supports laminate manufacture, copper-surface protection or dimensional and dielectric performance according to the selected material. Typical uses: One-component latent epoxy curing, Powder coatings, Structural and electronic adhesives.
Product information
- Applications:
- One-component latent epoxy curing, Powder coatings, Structural and electronic adhesives, Laminates and composites
- Hazard / Transport:
- Fine dust may irritate eyes and the respiratory tract and can present a combustible-dust risk. Typical solid grades are not commonly regulated as dangerous goods; confirm the supplied SDS and control dust during handling.
- Storage:
- Keep tightly sealed in a cool, dry and well-ventilated place. Protect from moisture, heat, ignition sources, strong acids, strong bases and oxidizing agents.