931-36-2
Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Fast epoxy cure acceleration, Electrical casting and potting, Electronic adhesives.
Application collection
Cure & Accelerate Electronic Epoxy Systems
Electronics & Electrical Materials · Powder & Processing Performance
Provides anhydride, amine, latent-hardener and imidazole options for cure-speed, latency and thermal-performance targets.
Cure & Accelerate Electronic Epoxy Systems
5
Name
CAS No.
Function & Usage
RFQ
693-98-1
Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Epoxy cure acceleration, Electronic encapsulation compounds, Powder coatings.
670-96-2
Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Latent epoxy acceleration, Copper-clad laminates, Electronic molding and encapsulation.
461-58-5
Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: One-component latent epoxy curing, Powder coatings, Structural and electronic adhesives.
19438-60-9
Provides curing or catalytic activity for epoxy systems, with latency, cure speed and thermal performance selected by formulation. Typical uses: Low-viscosity epoxy curing systems, Electrical impregnation and casting, Semiconductor and electronic encapsulation.
Safety note
Confirm technical and safety data before ordering
Website information supports initial product discovery. Final specifications, hazard classification, transport conditions and storage requirements must be confirmed by the latest grade-specific SDS, COA and destination-market regulations.