Products

614
NameCAS No.ApplicationsRFQ
78-27-3
Pharmaceutical intermediate synthesis, Acetylenic-alcohol and terminal-alkyne chemistry, Fine-chemical synthesis, Research and process development
95-14-7
Copper corrosion inhibitor, Boiler and cooling water treatment, Antifreeze and coolant additives, Metal detergents
1703-58-8
Formaldehyde-free durable-press textile finishing, Anti-crease cotton and cellulose finishing, Polyimide and electrical-material synthesis, Functional polymer crosslinking
1192-62-7
Sweet balsamic, almond and cocoa notes, Coffee, nut and baked flavor systems, Pharmaceutical and fine-chemical synthesis
22047-25-2
Popcorn, bread-crust and roasted-nut notes, Bakery, coffee and cocoa flavor systems, Savory flavor reconstruction
1122-62-9
Popcorn, roasted and tobacco aroma accords, Savory and baked flavor reconstruction, Pharmaceutical and fine-chemical synthesis
1072-83-9
Bread, roasted and nutty flavor accords, Coffee, cocoa and savory flavor systems, Flavor reconstruction
24295-03-2
Roasted meat, nut and sulfur flavor accords, Savory seasoning and reaction flavors, Flavor reconstruction
88-15-3
Roasted, nutty and sulfur flavor accords, Thiophene intermediate synthesis, Pharmaceutical and fragrance routes, Downstream specialty synthesis
13925-00-3
Roasted, nutty and cocoa notes, Coffee and bakery flavor systems, Savory flavor reconstruction
100-71-0
Roasted, tobacco and nutty aroma accords, Savory flavor reconstruction, Fine-chemical synthesis
18640-74-9
Green tomato, leafy and vegetal flavor notes, Savory and vegetable flavor reconstruction, Trace-dose aroma modification
149-30-4
Copper corrosion inhibition, Metalworking fluids, Rubber accelerator, Industrial cleaners, Cooling water formulations
28588-74-1
Meaty, roasted and coffee flavor accords, Savory reaction flavors and seasonings, Trace-dose aroma reconstruction
534-22-5
Coffee, roasted and caramel flavor reconstruction, Flavor-intermediate synthesis, Fine-chemical and pharmaceutical synthesis
693-98-1
Epoxy cure acceleration, Electronic encapsulation compounds, Powder coatings, Adhesives and laminates
670-96-2
Latent epoxy acceleration, Copper-clad laminates, Electronic molding and encapsulation, Heat-resistant adhesives