- Primary category
- Electronics & Electronic Materials
- Product Family
- Thermal Management & Dielectric Fillers
Product overview
Spherical Fused Silica is a functional material evaluated for Epoxy molding compounds, Underfill and encapsulation, Copper-clad laminates. Suitability for electrical or electronic use depends on the exact grade, impurity profile, particle-size or cure data, application testing and destination-market requirements.
Function & Usage
- Encapsulate, Pot & Electrically Insulate
Supports potting, casting, molding or encapsulation systems used to protect and electrically insulate components. Typical uses: Epoxy molding compounds, Underfill and encapsulation, Copper-clad laminates.
- Conduct Heat While Maintaining Electrical Insulation
Increases heat-transfer capability while supporting electrical insulation in compatible resin, adhesive and polymer systems. Typical uses: Epoxy molding compounds, Underfill and encapsulation, Copper-clad laminates.
- Build Laminates & Protect Copper
Supports laminate manufacture, copper-surface protection or dimensional and dielectric performance according to the selected material. Typical uses: Epoxy molding compounds, Underfill and encapsulation, Copper-clad laminates.
Product information
- Applications:
- Epoxy molding compounds, Underfill and encapsulation, Copper-clad laminates, Low-CTE electrical insulation composites
- Hazard / Transport:
- Fine amorphous silica dust can irritate eyes and the respiratory tract. Avoid inhalation and dust accumulation; verify crystalline-silica limits and the exact product SDS for the supplied grade.
- Storage:
- Keep sealed and dry in a clean, ventilated warehouse. Protect from moisture, contamination and package damage and control dust during transfer.