- Primary category
- Electronics & Electronic Materials
- Product Family
- Thermal Management & Dielectric Fillers
Product overview
Hexagonal Boron Nitride (hBN) is a functional material evaluated for Thermal interface materials, Electronic potting and overmolding, Thermally conductive adhesives. Suitability for electrical or electronic use depends on the exact grade, impurity profile, particle-size or cure data, application testing and destination-market requirements.
Function & Usage
- Encapsulate, Pot & Electrically Insulate
Supports potting, casting, molding or encapsulation systems used to protect and electrically insulate components. Typical uses: Thermal interface materials, Electronic potting and overmolding, Thermally conductive adhesives.
- Conduct Heat While Maintaining Electrical Insulation
Increases heat-transfer capability while supporting electrical insulation in compatible resin, adhesive and polymer systems. Typical uses: Thermal interface materials, Electronic potting and overmolding, Thermally conductive adhesives.
Product information
- Applications:
- Thermal interface materials, Electronic potting and overmolding, Thermally conductive adhesives, Electrically insulating polymer compounds
- Hazard / Transport:
- Fine dust may cause mechanical eye and respiratory irritation. Typical commercial grades are not commonly regulated as dangerous goods; use dust controls and confirm the supplied SDS.
- Storage:
- Keep sealed in a cool, dry and clean place. Protect from moisture, contamination and package damage and minimize airborne dust during handling.